Production Capability
Manufacturing & Assembly
Up to 42-layer PCB · ±0.03mm precision · 52 million placements per month.
Manufacturing Capacity
PCB Production Capabilities
World-class PCB manufacturing capabilities to support your most demanding projects.
- Layers
- Up to 42
- Min Line Width/Spacing (Inner)
- 3.0/3.0 mil
- Min Line Width/Spacing (Outer)
- 4.0/4.0 mil
- Copper Weight
- 0.5 – 6.0 OZ
- Max Aspect Ratio
- 11:1
- Board Thickness
- 0.2mm – 8.0mm
- Max Panel Size
- 18″ × 24″
- Min Hole Diameter
- 4 mil
- Material
- FR-4, High Tg FR-4, Halogen free, Rogers, Arlon, Taconic, Nelco
- Surface Treatment
- HASL, ENIG, Immersion Silver, Immersion Tin, Lead free HASL
- Impedance Control
- +/-10%
SMT Production
SMT Production Capabilities
| Max PCB Size | 680 × 500 mm |
|---|---|
| Min PCB Size | 45 × 45 mm |
| Board Thickness | 0.4 – 5 mm |
| Min Components Size | 0201 / 01005 |
| Component Max Height | 25 mm |
| Min Lead Pitch | 0.35 mm |
| Min BGA Ball Pitch | 0.4 mm |
| Placement Precision | +/- 0.03 mm |
Our Equipment
Advanced Equipment
AOI Machine
Automated optical inspection for 100% surface defect detection on all assemblies
X-Ray Machine
Real-time X-ray inspection for BGA, QFN, and hidden solder joint verification
SMT Pick & Place
High-speed component placement at 0.15 seconds per chip with ±0.03mm precision
Reflow Oven
Nitrogen-atmosphere reflow soldering with 10-zone temperature profile control
Wave Solder
Lead-free wave soldering for through-hole and mixed technology assemblies
ICT Testing
In-circuit testing with custom fixtures for 100% electrical verification
Get In Touch
We would love to hear from you!
If you would like to know more details, please contact me online. Our team is ready to help with your PCB needs.